2022 New Type Sn63Pb37 Solder Paste Flux for Soldering 183℃ SMD Rework IC PCB BGA Iphone Repair Welding Paste

Description

Sn63Pb37：Leaded medium temperature solder paste，Melting point: 183°C
Suitable for basic PCB component maintenance,IC,SMD, more commonly used.
Sn42Bi58：Lead-free low temperature solder paste，Melting point: 138°C
LED type special non-high temperature resistant board is used, general products are not recommended.
Sn62.8Pb36.8Ag0.4:Medium temperature silver-containing solder paste,Melting point: 183°C
Suitable for mobile phone tail plug, basic PCB component repair welding is recommended.
Sn64Bi35Ag1:Lead-free medium temperature environmental protection solder paste,Melting point: 183°C
Suitable for Lead-free products, soldering use with special requirements for reflow soldering, specific maintenance use.
Sn99Ag0.3Cu0.7:Lead-free environmentally friendly high temperature solder paste,Melting point: 217°C
Suitable forSMT process or special process capable of withstanding high temperature.
We have low temperature, medium temperature and high temperature solder paste. If you are not sure which solder paste you need to use for your product, you can consult customer service. If you have not received the goods, please contact customer service in time,We will process your order in time after seeing the information, please rest assured.
How to use?
Since the product needs to be refrigerated to 0-10℃, it needs to be taken out and thawed before use, and the board should be preheated before use, so that the solder paste will be smoother
Need to pay attention when using
To work in a ventilated environment
Avoid frequent skin contact，If it gets on the skin, wipe it with alcohol and rinse with water
Do not touch sensitive parts
How to store the solder paste？
Should be stored in an environment of 1-10 ℃